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Hopeflam DOPO
    • Hopeflam DOPO
Product Details

Chemical name: 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide

CAS No.35948-25-5

Mol. wt.216.16

MgFeC12H9O2P

Specification:

Item

Standard

Appearance

White crystalline powder or particle

Content (HPLC)

≥99%

Specific gravity30℃

1.402

Melting point

116℃-120℃

Boiling point 1mmHg

200℃

P content

≥14%

Cl

≤50ppm

Fe

≤20ppm

Application:

Hopeflam DOPO is easily soluble in methanol, ethanol, chloroform, etc., soluble in benzene, toluene, chlorobenzene, etc., insoluble in water. With high thermal stability, oxidation resistance and excellent water resistance, it is a reactive and additive flame retardant.

It can be used as flame retardants for luminescent materials, modified materials, linear polyesters, polyamides, epoxy resins, and polyurethanes. It is widely used in plastics for electronic equipment and copper laminate circuit boards. DOPO has phosphorus-carbon bonds, it has better flame retardancy than general phosphate esters, and it is also featured with environmental protection, non-migration and long-lasting flame retardancy.

DOPO can be used to modify luminescent materials, making the material excellent in thermal stability, flame retardancy and mechanical properties., to produce LCD panel.

DOPO can also prevent coloring, such as coloring caused by heat in ABS, AS, PP, PS, epoxy resin, phenolic resin, alkyd resin, surface active agents, coloring caused by light and heat in polyurethane.

The dosage varies according to the material, the P content after reaction should be around 2%.

e.g.

1. Directly introduce DOPO into the main body of the epoxy resin (bisphenol A epoxy compound E51) to make a phosphorus-containing epoxy resin with a phosphorus content of about 2, can reach UL-94 V-0 level and has high mechanical strength. The glass transition temperature of the cured product is 126℃, which can be used in the manufacture of electronic products such as copper clad laminates.

2. The curing agent of epoxy resin can be prepared with DOPO and p-hydroxybenzaldehyde. The Tg of epoxy resin DOPO-PN/CNE200 (ortho-cresol varnish epoxy) system exceeds 160°C, the thermal decomposition temperature is higher than 300°C, with 2 % phosphorus content, the LOI of DOPO-PN cured epoxy resin is 26, and UL-94 is V-0.

3. With 20wt % in PA6, DOPO can reach UL-94 V-0.

Package and storage:

25k paper bag. Stored in dry and ventilated place.


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